JEDEC JESD 22-A121A

$74.00

MEASURING WHISKER GROWTH ON TIN AND TIN ALLOY SURFACE FINISHESJEDEC Solid State Technology Association / 01-Jul-2008 / 31 pages

The predominant terminal finishes on electronic components have been Sn-Pb alloys. As the industry moves toward Pb-free components and assembly processes, the predominant terminal finish materials will be pure Sn and alloys of Sn, including Sn-Bi and Sn-Ag. Pure Sn and Sn-based alloy electrodeposits and solder-dipped finishes may grow tin whiskers, which could electrically short across component terminals or break off the component and degrade the performance of electrical or mechanical parts.




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