IPC TR-486


Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer SeparationsAssociation Connecting Electronics Industries / 01-Jul-2001 / 56 pages

This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes. Includes background on the Post Separation Task Group, test results, round robin test plan, conclusions and test methods used.

Product Code(s): TR-486(D)1,TR-486(D)1

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  • Model: 4GIZZGOC
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This product was added to our catalog on Thursday 01 January, 1970.

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