IPC 7525B


Stencil Design GuidelinesAssociation Connecting Electronics Industries / 01-Oct-2011 / 36 pages

This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.

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This product was added to our catalog on Thursday 01 January, 1970.

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