IPC 6015


Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting StructuresAssociation Connecting Electronics Industries / 01-Feb-1998 / 25 pages

This specification establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) assembly and the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011.

Product Code(s): 6015(D)1

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  • Model: NEJXULHI
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