IPC 4563


Resin Coated Copper Foil for Printed Boards GuidelineAssociation Connecting Electronics Industries / 01-Nov-2007 / 19 pages

This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.

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  • Model: H5DOCHZI
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This product was added to our catalog on Thursday 01 January, 1970.

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