IPC 3408


General Requirements for Anisotropically Conductive Adhesives FilmsAssociation Connecting Electronics Industries / 01-Nov-1996 / 32 pages

This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.

Product Code(s): 3408(D)1

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  • Model: LOUENW3V
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This product was added to our catalog on Thursday 01 January, 1970.

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