IPC 2614


Sectional Requirements for Board Fabrication DocumentationAssociation Connecting Electronics Industries / 01-Mar-2010 / 59 pages

This standard establishes the requirements for the documentation of printed circuit board fabrication, and identifies the physical attributes and performance requirements of the unpopulated product. The descriptions apply to rigid, flexible, inorganic substrates or any combination thereof. The construction may be single, double, multilayered, or HDI technology and may include embedded (integrated) components. The requirements pertain to both hard copy and electronic data descriptions.

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