Specifications for High Density Interconnect (HDI) and Microvia MaterialsAssociation Connecting Electronics Industries / 01-May-1999 / 100 pages

Covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias.The 23 specification sheets included in IPC/JPCA-4104 specify the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils. IPC/JPCA-4104 also includes six new test methods developed specifically for the testing of HDI and microvia materials.

Product Code(s): 4104(D)1

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  • Model: 5HWGXUNO
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This product was added to our catalog on Thursday 01 January, 1970.

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