Specification for Base Materials for High Speed/High Frequency ApplicationsAssociation Connecting Electronics Industries / 01-Jan-2002 / 41 pages

Covers the requirements for high speed / high frequency laminate or bonding layers to be used primarily for the fabrication of rigid or multilayer printed boards for high speed / high frequency electrical and electronic circuits. Some of the improvements over the IPC-L-125A specification include updated bonding layer testing parameters, inspection lot requirements, revised visual acceptance criteria, and new specification sheets for hydrocarbon and polyester resin systems. Supersedes IPC-L-125A.

Product Code(s): 4103(D)1,4103(D)1

Add to Cart:

  • Model: CW8OO2E7
  • 8888 Units in Stock

This product was added to our catalog on Thursday 01 January, 1970.

Your IP Address is:
Copyright © 2018 Buy Standards.