ANSI/IPC 2225

$57.00

Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)Association Connecting Electronics Industries / 01-May-1998 / 44 pages

This standard establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia material properties, relationships with DFM and DFE.

Product Code(s): 2225(D)1




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